Package Design Intern
Marvell
- București
- Pregătire
- Part-time
- Interact with PD team optimize active die and perform package planning
- Perform package design for a flip chip package based on existing netlist
- Use Cadence Allegro Package Designer (APD)
- Perform package specific SI/PI simulations
- Candidate MUST be currently pursuing a BS degree in Electronics or related technical field(s)
- 0-1 years of previous experience
- Basic electronics knowledge (circuits, circuit simulation, basic circuits function knowledge)
- Basic layout knowledge (routing, basic design rules for PCB and semiconductor)
- Fair signal theory and signal transmission knowledge
- Basic electric simulations knowledge (time and frequency domain)
- Basic microwaves theoretical knowledge
- Practical implementation of PCB routing as part of personal or curricular projects is a plus
- Good English (spoken and written)